Taiwan Semiconductor Manufacturing Company (TSMC) has announced that its new N4X process technology aimed at high-performance computing (HPC) workloads and devices. It is all set for trial production in the first half of 2023.
The introduction of this new N4X process technology by TSMC marks the company’s debut into the growing HPC market. Further, it has been revealed that the N4X process aims to make transistors as small as 5nm.
The N4X design is an enhancement of its N5A, improving upon its performance and maximum clock frequencies. It is claimed to deliver around a 15 percent of performance boost when compared to the N5 processes.
The company is also claiming that the N4X offers a 4 percent performance improvement over its N4P process at 1.2 volts. The “X” denotes TSMC’s growing push into the HPC chip design sector, which the company said is among its fastest-growing business segments.
Dr. Kevin Zhang, senior vice president of Business Development at TSMC, said: “The demands of the HPC segment are unrelenting, and TSMC has not only tailored our ‘X’ semiconductor technologies to unleash ultimate performance but has also combined it with our 3DFabric advanced packaging technologies to offer the best HPC platform.”
Risk production for this new N4X is expected by the first half of 2023, which means that we can expect the first N4X designs to be available in the market by early 2024.
RELATED:
- TSMC top 10 customers revealed: Apple accounts for a quarter of total revenue
- Intel CEO’s visit to Taiwan is likely to pressure TSMC over chip orders: Analysts
- Oppo and OnePlus phones tipped to use in-house chips based on TSMC’s 6nm node
- TSMC starts pilot production of 3nm process that may power 2023 iPhones and Macs
- Intel to deepen relations with TSMC to secure 3nm chip & avoid conflict with Apple
